|
Thick Film Hybrid Circuits |
|
|
|
|
Substrates
|
|
| Material |
Alumina
96%
|
| Substrate
Power |
0.330mW/cm2
|
| Thermal
conductivity (20–100oC)
|
24W/mK
|
| Thermal
expansion (10-6/oC)
|
7.1
|
| Dielectric
rigidity (KV/mm)
|
8.3
|
| Dielectric
constant K at 10Mhz
|
10
|
| Maximum
dimension (mm)
|
152.4
x 152.4
|
| Thickness
(mm)
|
0.254
– 1.00 |
| Through
hole diameter (mm)
|
typical
0.254
|
| Dissipation
(W/cm2) |
0.5 |
|
| Resistors |
Ruthenium
based, screen printed, laser trimmed.
|
| Resistor
Range |
0.1
to 5.0G |
| Tolerance |
±
0.5% across range
|
Matching |
±
0.5% (after 1000 hrs at max element temp)
|
|
Temperature
coefficient of
|
|
|
Resistance |
±100ppm/oC
across range
|
|
Tracking |
±
25ppm/oC 10 to 1M
|
|
Voltage
Proof |
400V
DC
|
|
Operating
Temperature
Range |
-55oC
to 125oC
|
|
Typical
Dissipation (W/mm2)
|
0.31
|
|
AC
& DC Functional Trim Capability
|
Yes |
|
|
|
| Conductors
|
Screen
printed with multi-layers conductor |
| Conductor
Current Density |
1A
at .254 mm wide (0.01") for silver palladium at standard
thickness of 10
|
Resistivity
|
Ag
(2)
AgPd
(30)
AgPt
(2)
Au
(3)
AuPt
(60) |
|
Screen
printing resolution
Width/Space |
125
|
